?004 fairchild semiconductor corporation j une 2004 RMWT04001 rev. d RMWT04001 RMWT04001 4?2 ghz tripler mmic general description the RMWT04001 is a 4 to 12 ghz tripler designed for use in point to point and point to multi-point radios, and various communications applications. in conjunction with other fairchild rf components amplifiers, multipliers and mixers it forms part of a complete 23, 26 and 38 ghz transmit/ receive chipset. the RMWT04001 utilizes our 0.25 ? power phemt process and is sufficiently versatile to serve in a variety of multiplier applications. features ? mil substrate conversion loss 14db (typ.) no dc bias required chip size 1.8mm x 1.05mm absolute ratings electrical characteristics (at 25?), 50 ? system, pin = +18 dbm symbol parameter ratings units p in rf input power (from 50 ? source) +25 dbm t c operating baseplate temperature -30 to +85 ? t stg storage temperature range -55 to +125 ? p arameter min typ max units input frequency range 2.8 4.0 ghz output frequency range 8.4 12.0 ghz input drive power +16 +18 dbm conversion loss 14 16.5 db conversion loss variation vs freq 0.7 db fundamental rejection -25 dbc 2nd harmonic rejection -20 dbc 4th harmonic rejection -20 dbc 5th harmonic rejection -30 dbc input return loss (pin = +18dbm) 10 db device
?004 fairchild semiconductor corporation RMWT04001 rev. d RMWT04001 application information caution: this is an esd sensitive device . chip carrier material should be selected to have gaas compatible thermal coefficient of expansion and high thermal conductivity such as copper molybdenum or copper tungsten. the chip carrier should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325? for 15 minutes. die attachment should utilize gold/tin (80/20) eutectic alloy solder and should avoid hydrogen environment for phemt devices. note that the backside of the chip is gold plated and is used as rf ground. these gaas devices should be handled with care and stored in dry nitrogen environment to prevent contamination of bonding surfaces. these are esd sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. all die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device. recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short as practical allowing for appropriate stress relief. the rf input and output bonds should be typically 0.012" long corresponding to a typical 2 mil gap between the chip and the substrate material. figure 1. functional block diagram figure 2. chip layout and bond pad locations (chip size is 1.8mm x 1.05mm x 100?. back of chip is rf and dc ground) mmic chip rf out rf in ground (back of chip) x3 dimensions in mm 0.0 0.0 0.0 0.0 1.05 1.05 1.8 1.8 0.592 0.448 0.592 0.448
?004 fairchild semiconductor corporation RMWT04001 rev. d RMWT04001 figure 3. recommended application schematic circuit diagram 5 mil thick alumina 50 ? 5 mil thick alumina 50 ? die-attach 80au/20sn rf output l < 0.015" (2 places) rf input 2 mil gap note: use 0.003" by 0.0005" gold ribbon for bonding. rf input and output bonds should be less than 0.015" long with stress relief. recommended procedure for operation the following sequence must be followed to properly test the amplifier. step 1: the RMWT04001 does not require dc bias. apply rf input signal at the appropriate frequency band and input drive level. step 2: follow turn-off sequence of: turn off rf input power.
?004 fairchild semiconductor corporation RMWT04001 rev. d RMWT04001 typical characteristics -20.00 -19.00 -18.00 -17.00 -16.00 -15.00 -14.00 -13.00 -12.00 -11.00 -10.00 7.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5 13 13.5 output frequency (ghz) 3.5 3 2.5 4 4.5 5 output frequency (ghz) RMWT04001, 4 to 12 ghz tripler, typical performance, chip bonded into 50 ? test fixture RMWT04001, 4 to 12 ghz tripler, typical performance, chip bonded into 50 ? test fixture conversion gain (db) rejection relative to third harmonic (dbc) -50 -40 -30 -20 -10 0 pin = +16dbm 5th harmonic 4th harmonic 2nd harmonic fundamental pin = +16dbm pin = +20dbm pin = +22dbm
?004 fairchild semiconductor corporation RMWT04001 rev. d RMWT04001 typical characteristics (continued) -30 -26 -22 -18 -14 -10 9 10.5 12 12.75 13.50 14.25 15 +25? +75? output frequency (ghz) RMWT04001, 4 to 12 ghz tripler, typical performance variation with temperature, chip bonded into 50 ? test fixture conversion gain (db)
disclaimer fairchild semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. fairchild does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. trademarks the following are registered and unregistered trademarks fairchild semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. life support policy fairchild?s products are not authorized for use as critical components in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. product status definitions definition of terms datasheet identification product status definition advance information preliminary no identification needed obsolete this datasheet contains the design specifications for product development. specifications may change in any manner without notice. this datasheet contains preliminary data, and supplementary data will be published at a later date. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains final specifications. fairchild semiconductor reserves the right to make changes at any time without notice in order to improve design. this datasheet contains specifications on a product that has been discontinued by fairchild semiconductor. the datasheet is printed for reference information only. formative or in design first production full production not in production isoplanar? littlefet? microcoupler? microfet? micropak? microwire? msx? msxpro? ocx? ocxpro? optologic ? optoplanar? pacman? pop? fast ? fastr? fps? frfet? globaloptoisolator? gto? hisec? i 2 c? i-lo ? implieddisconnect? rev. i11 acex? activearray? bottomless? coolfet? crossvolt ? dome? ecospark? e 2 cmos? ensigna? fact? fact quiet series? power247? powersaver? powertrench ? qfet ? qs? qt optoelectronics? quiet series? rapidconfigure? rapidconnect? serdes? silent switcher ? smart start? spm? stealth? superfet? supersot?-3 supersot?-6 supersot?-8 syncfet? tinylogic ? tinyopto? trutranslation? uhc? ultrafet ? vcx? across the board. around the world.? the power franchise ? programmable active droop?
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